Polyamide Resin | 63428-84-2
Product Description:
Polyamide resin ndeyero yegranula yakajeka yakasimba. Senge isiri-reactive polyamide resin, inogadzirwa kubva ku dimer acid uye amines.
Product Application:
| Aihwa. | Hunhu | Aihwa. | Application | |
| 1 | Chimiro chakagadzikana, kunamatira kwakanaka, kupenya kwepamusoro | 1 | Gravure uye flexographics epurasitiki kudhinda inki | |
| 2 | Yakanaka inoenderana neNC | 2 | Pamusoro pekudhinda varnish | |
| 3 | Kusunungurwa kwakanaka kwe solvent | 3 | Adhesive | |
| 4 | Kuramba kwakanaka kune gel, yakanaka thaw pfuma | 4 | Kupisa kuvhara kuvhara |
Kutsanangurwa kweChigadzirwa:
| Types | MaGrades | Asidhi yakakosha (mgKOH/g) | Amine value (mgKOH/g) | Viscosity (mpa.s/25°C) | Kupfava (°C) | Nzvimbo yechando (°C) | Ruvara (Gardner) |
| Co-solvent | CC-3000 | ≤5 | ≤5 | 30-70 | 110-125 | ≤6 | ≤7 |
| CC-1010 | ≤5 | ≤5 | 70-100 | 110-125 | ≤6 | ≤7 | |
| CC-1080 | ≤5 | ≤5 | 100-140 | 110-125 | ≤6 | ≤7 | |
| CC-1150 | ≤5 | ≤5 | 140-170 | 110-125 | ≤6 | ≤7 | |
| CC-1350 | ≤5 | ≤5 | 170-200 | 110-125 | ≤6 | ≤7 | |
| Co-solvent · Kuomesa nechando | CC-1888 | ≤5 | ≤5 | 30-200 | 90-120 | -15~0 | ≤7 |
| Co-solvent · High tembiricha kuramba | CC-2888 | ≤5 | ≤5 | 30-180 | 125-180 | / | ≤7 |
| Co-solvent·Kupenya kwepamusoro | CC-555 | ≤5 | ≤5 | 30-180 | 110-125 | ≤6 | ≤7 |
| Co-solvent · Oil resistance | CC-655 | ≤6 | ≤6 | 30-180 | 110-125 | ≤6 | ≤7 |
| Mhando yefirimu isina kurapwa | CC-657 | ≤15 | ≤3 | 40-100 | 90-100 | ≤2 | ≤12 |
| Doro rinonyungudika | CC-2018 | ≤5 | ≤5 | 30-160 | 115-125 | ≤4 | ≤7 |
| Doro rinonyungudika · Kuomesa nechando | CC-659A | ≤5 | ≤5 | 30-160 | 100-125 | -15~0 | ≤7 |
| Doro rinonyungudika · Kuramba tembiricha yepamusoro | CC-1580 | ≤5 | ≤5 | 30-160 | 120-150 | / | ≤7 |
| Ester soluble | CC-889 | ≤5 | ≤5 | 40-120 | 105-115 | ≤4 | ≤7 |
| Ester soluble · Kuomesa nechando | CC-818 | ≤5 | ≤5 | 40-120 | 90-110 | -15~0 | ≤7 |
Package:25 kgs / bhegi kana sezvaunokumbira.
Kuchengeta:Chengetedza panzvimbo ine mhepo, yakaoma.
ExecutiveStandard:International Standard.
